SEMI FlexTech Invites Proposals for FHE Innovations

FlexTech, a SEMI Technology Community, issued a Request for Proposals (RFP) to advance flexible hybrid electronics (FHE) technologies, including the development of advanced materials and additive processing. Selected projects will receive cash awards ranging from $250,000 to $1 million.

The program is funded by the Army Research Laboratory (ARL). ARL funding will be matched with contributions by grant recipients to cover total project cost. The RFP seeks proposals targeting FHE advances in the following areas:
• Development of Novel Materials, Additive Processing, and Printed Electronics for Harsh Environments
• Advancement in High-Density, Multi-Layer Interconnect Technology for Ultra-Narrow Linewidth and Spacing, FHE and Hybrid Electronics Packaging
• Advanced Design and Modeling Tools for FHE
• FHE Manufacturing, Standards, and Reliability
• Other (Restricted Open Topics) – Sensing, AI/ML Applications, Thermal Management

Organizations submitting proposals will be evaluated based on their capabilities, experiences, and strengths including team diversity.

White paper submissions, the first step in responding to the RFP, are due July 21, 2024. Following the review of white papers by the RFP review committee, FlexTech will invite selected organizations to submit full proposals.

To help organizations craft their proposals, FlexTech staff will review the RFP topics and the submission and review process during a live webinar on June 24, 2024, at 10:00am PDT. A recording will be available for registrants unable to attend the event.